Datasheet
ADT7408
Rev. 0 | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
V
DD
to V
SS
–0.3 V to +7 V
SDA Input Voltage to V
SS
–0.3 V to V
DD
+ 0.3 V
SDA Output Voltage to V
SS
–0.3 V to V
DD
+ 0.3 V
SCL Input Voltage to V
SS
–0.3 V to V
DD
+ 0.3 V
EVENT# Output Voltage to V
SS
–0.3 V to V
DD
+ 0.3 V
Operating Temperature Range –55°C to +150°C
Storage Temperature Range –65°C to +160°C
Maximum Junction Temperature, T
JMAX
150°C
Thermal Resistance
1
θ
JA
, Junction-to-Ambient (Still Air)
85
o
C/W
IR Reflow Soldering Profile Refer to Figure 3
1
Power Dissipation P
MAX
= (T
JMAX
− T
A
)/θ
JA
, where T
A
is the ambient
temperature. Thermal resistance value relates to the package being used on
a standard 2-layer PCB, which gives a worst-case θ
JA
. Some documents may
publish junction-to-case thermal resistance θ
JC
, but it refers to a component
that is mounted on an ideal heat sink. As a result, junction-to-ambient
thermal resistance is more practical for air-cooled, PCB-mounted
components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
480 SECONDS MAX.
60 – 180 SECONDS 20 – 40 SECONDS
TEMPERATURE (°C)
TIME (Seconds
)
260 – 5/+0°C
150°C – 200°C
RAMP DOWN
6°C/SECOND
MAX.
217°C
RAMP UP
3°C/SECOND MAX
60 – 150 SECONDS
05716-003
Figure 3. LFCSP Pb-Free Reflow Profile Based on JEDEC J-STD-20C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-
tion or loss of functionality.