Datasheet

ADT7301
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
V
DD
to GND −0.3 V to +7 V
Digital Input Voltage to GND −0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to GND −0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
1
−40°C to +150°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
6-Lead SOT-23 (RT-6)
Power Dissipation
2
W
MAX
= (T
J
max − T
A
3
)/θ
JA
Thermal Impedance
θ
JA
, Junction-to-Ambient
(Still Air)
190.4°C/W
8-Lead MSOP (RM-8)
Power Dissipation
2
W
MAX
= (T
J
max − T
A
3
)/θ
JA
Thermal Impedance
4
θ
JA
, Junction-to-Ambient
(Still Air)
205.9°C/W
θ
JC
, Junction-to-Case 43.74°C/W
IR Reflow Soldering
Peak Temperature 220°C (0°C /5°C)
Time at Peak Temperature 10 sec to 20 sec
Ramp-Up Rate 3°C/s max
Ramp-Down Rate −6°C/s max
Time 25°C to Peak Temperature 6 minutes max
IR Reflow Soldering—Pb-Free Package
Peak Temperature 260°C (0°C)
Time at Peak Temperature 20 sec to 40 sec
Ramp-Up Rate 3°C/s max
Ramp-Down Rate −6°C/s max
Time 25°C to Peak Temperature 8 minutes max
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability
02884-003
TEMPERATURE (°C)
–40 150 140 130 120 110 100
90 80 70 60 50 40 30 20 10
0
–10 –20 –30
MAXIMUM POWER DISSIPATION (W)
1.2
1.0
0.8
0.6
0.4
0.2
0
SOT-23
MSOP
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
1
It is not recommended to operate the ADT7301 at temperatures above
125°C for greater than a total of 5% (5,000 hours) of the lifetime of the
device. Any exposure beyond this limit affects device reliability.
2
Values relate to the package being used on a standard 2-layer PCB. Refer
to Figure 3 for a plot of maximum power dissipation vs. ambient
temperature (T
A
).
3
T
A
= ambient temperature.
4
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.