Datasheet

Rev. D | Page 46 of 48 | May 2012
ADSP-TS203S
OUTLINE DIMENSIONS
The ADSP-TS203S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
The following table is provided as an aide to PCB design. The
numbers listed in the table are for reference purposes and
should not supersede the PCB design rules. Please reference
IPC-7351, Surface Mount Design and Land Pattern Standard,
for PCB design recommendations.
Figure 45. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE CONFORMS TO JEDEC MS-034 SPECIFICATION.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
79531
1113
15
1721 1923
68
10121416182024 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOTTOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Package Ball Attach Type
Solder Mask
Opening Ball Pad Size
576-Ball BGA_ED
(BP-576-1)
Nonsolder Mask
Defined (NSMD)
0.69 0.56