Datasheet

ADSP-TS202S
Rev. C | Page 45 of 48 | December 2006
OUTLINE DIMENSIONS
The ADSP-TS202S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Figure 47. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETAIL A
NOTES:
1. ALL DIMENS IO NS ARE IN MILL IMET ERS.
2. THE ACTUA L POSITION O F THE BAL L GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITIO N RELATIVE TO T HE PACKAGE EDGES.
3. CE NTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAGE C ONFORMS TO JE DEC MS-034 SP ECIFICATION.
SEATING P LANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
79531
1113
15
1721 1923
68
10121416182024 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOT TOM VI EW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Table 36. BGA Data for Use with Surface Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
576-Ball BGA_ED
(BP-576)
Nonsolder Mask Defined (NSMD) 0.69 mm diameter 0.56 mm diameter