Datasheet

Rev. C | Page 44 of 48 | May 2009
ADSP-TS101S
SURFACE-MOUNT DESIGN
The following table is provided as an aide to PCB design.
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
Figure 44. 625-Ball PBGA (B-625)
1.00
BSC
SQ
BALL
PITCH
0.70
0.60
0.50
BALL DIAMETER
24.20
24.00
23.80
2.50 MAX
DET AIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE COMPLI ES WITH THE JEDEC MS-034 SPECIFICATION,
BUT USES TIGHTER TOLERANCES THAN THE MAXIMUMS ALLOWED IN
THAT SPECIFICATION.
SEATING PLANE
1.25 MAX
0.20 MAX
DETAIL A
0.65
0.55
0.45
0.40 MIN
27.20
27.00 SQ
26.80
79531
1113
15
1721 192325
68
10121416182024 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AE
AD
AC
AB
AA
24.00
BSC
SQ
24.20
24.00
23.80
27.20
27.00
26.80
27.20
27.00
26.80
TOP VIEW BOTTOM VIE W
1.50
BSC
SQ
1.50
BSC
SQ
Package Ball Attach Type Solder Mask Opening Ball Pad Size
625-ball (27 mm) PBGA Solder Mask Defined (SMD) 0.45 mm diameter 0.60 mm diameter
484-ball (19 mm) PBGA Solder Mask Defined (SMD) 0.40 mm diameter 0.53 mm diameter