Datasheet

Rev. C | Page 36 of 48 | May 2009
ADSP-TS101S
ENVIRONMENTAL CONDITIONS
The ADSP-TS101S is rated for performance over the extended
commercial temperature range, T
CASE
= –40°C to +85°C.
Thermal Characteristics
The ADSP-TS101S is packaged in a 19 mm  19 mm and
27 mm  27 mm Plastic Ball Grid Array (PBGA). The
ADSP-TS101S is specified for a case temperature (T
CASE
). To
ensure that the T
CASE
data sheet specification is not exceeded, a
heat sink and/or an air flow source may be used. See Table 33
and Table 34 for thermal data.
Figure 39. Typical Output Rise and Fall Time (10%–90%, V
DD_IO
=3.3V)
vs. Load Capacitance at Strength 7
Figure 40. Typical Output Valid (V
DD_IO
= 3.3 V) vs. Load Capacitance at Max
Case Temperature and Strength 0–7
1
1
The line equations for the output valid vs. load capacitance are:
Strength 0: y = 0.0956x + 3.5662
Strength 1: y = 0.0523x + 3.2144
Strength 2: y = 0.0433x + 3.1319
Strength 3: y = 0.0391x + 2.9675
Strength 4: y = 0.0393x + 2.7653
Strength 5: y = 0.0373x + 2.6515
Strength 6: y = 0.0379x + 2.1206
Strength 7: y = 0.0399x + 1.9080
0 102030405060708090100
0
5
10
15
20
25
R
I
S
E
A
N
D
F
A
L
L
T
I
M
E
S
(
n
s
)
LOAD CAPACITANCE (pF)
RISE TIME
y = 0.0907x + 1.0071
FALL TIME
y = 0.09x + 0.3134
STRENGTH 7
(V
DD_IO
=3.3V)
0 102030405060708090100
0
5
10
15
O
U
T
P
U
T
V
A
L
I
D
(
n
s
)
LOAD CAPACITANCE (pF)
0
1
2
3
4
5
6
7
STRENGTH 0-7
(V
DD_IO
=3.3V)
Table 33. Thermal Characteristics
for 19 mm  19 mm Package
Parameter Condition Typical Unit

JA
1
1
Determination of parameter is system dependent and is based on a number of
factors, including device power dissipation, package thermal resistance, board
thermal characteristics, ambient temperature, and air flow.
Airflow
2
= 0 m/s
2
Per JEDEC JESD51-2 procedure using a four layer board (compliant with JEDEC
JESD51-9).
16.6 °C/W
Airflow
3
= 1 m/s
3
Per SEMI Test Method G38-87 using a four layer board (compliant with JEDEC
JESD51-9).
14.0 °C/W
Airflow
3
= 2 m/s 12.9 °C/W

JC
6.7 °C/W

JB
5.8 °C/W
Table 34. Thermal Characteristics
for 27 mm  27 mm Package
Parameter Condition Typical Unit

JA
1
1
Determination of parameter is system dependent and is based on a number of
factors, including device power dissipation, package thermal resistance, board
thermal characteristics, ambient temperature, and air flow.
Airflow
2
= 0 m/s
2
Per JEDEC JESD51-2 procedure using a four layer board (compliant with JEDEC
JESD51-9).
13.8 °C/W
Airflow
3
= 1 m/s
3
Per SEMI Test Method G38-87 using a four layer board (compliant with JEDEC
JESD51-9).
11.7 °C/W
Airflow
3
= 2 m/s 10.8 °C/W

JC
3.1 °C/W

JB
5.9 °C/W