Datasheet
Table Of Contents
- Blackfin Dual Core Embedded Processor
- Features
- Memory
- Table Of Contents
- Revision History
- General Description
- ADSP-BF60x Detailed Signal Descriptions
- 349-Ball CSP_BGA Signal Descriptions
- GP I/O Multiplexing for 349-Ball CSP_BGA
- ADSP-BF60x Designer Quick Reference
- Specifications
- Operating Conditions
- Electrical Characteristics
- Processor — Absolute Maximum Ratings
- ESD Sensitivity
- Processor — Package Information
- Timing Specifications
- Clock and Reset Timing
- Power-Up Reset Timing
- Asynchronous Read
- Asynchronous Flash Read
- Asynchronous Page Mode Read
- Synchronous Burst Flash Read
- Asynchronous Write
- Asynchronous Flash Write
- All Accesses
- Bus Request/Bus Grant
- DDR2 SDRAM Clock and Control Cycle Timing
- DDR2 SDRAM Read Cycle Timing
- DDR2 SDRAM Write Cycle Timing
- Mobile DDR SDRAM Clock and Control Cycle Timing
- Mobile DDR SDRAM Read Cycle Timing
- Mobile DDR SDRAM Write Cycle Timing
- Enhanced Parallel Peripheral Interface Timing
- Link Ports
- Serial Ports
- Serial Peripheral Interface (SPI) Port—Master Timing
- Serial Peripheral Interface (SPI) Port—Slave Timing
- Serial Peripheral Interface (SPI) Port—SPI_RDY Slave Timing
- Serial Peripheral Interface (SPI) Port—Open Drain Mode Timing
- Serial Peripheral Interface (SPI) Port—SPI_RDY Timing
- General-Purpose Port Timing
- Timer Cycle Timing
- Up/Down Counter/Rotary Encoder Timing
- Pulse Width Modulator (PWM) Timing
- ADC Controller Module (ACM) Timing
- Universal Asynchronous Receiver-Transmitter (UART) Ports—Receive and Transmit Timing
- CAN Interface
- Universal Serial Bus (USB) On-The-Go—Receive and Transmit Timing
- RSI Controller Timing
- 10/100 Ethernet MAC Controller Timing
- JTAG Test And Emulation Port Timing
- Output Drive Currents
- Environmental Conditions
- ADSP-BF60x 349-Ball CSP_BGA Ball Assignments
- Outline Dimensions
- Automotive Products
- Ordering Guide

Rev. 0 | Page 54 of 112 | June 2013
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609
ELECTRICAL CHARACTERISTICS
Parameter Test Conditions Min Typical Max Unit
V
OH
1
High Level Output Voltage V
DD_EXT
= 1 . 7 V, I
OH
= –0.5 mA V
DD_EXT
– 0.40 V
V
OH
1
High Level Output Voltage V
DD_EXT
= 3 . 1 3 V , I
OH
= –0.5 mA V
DD_EXT
– 0.40 V
V
OH_DDR2
2
High Level Output Voltage, ds = 00 V
DD_DMC
= 1.70 V, I
OH
= –13.4 mA 1.388 V
V
OH_DDR2
3
High Level Output Voltage, ds = 10 V
DD_DMC
= 1.70 V, I
OH
= –6.70 mA 1.311 V
V
OH_LPDDR
4
High Level Output Voltage, ds = 00 V
DD_DMC
= 1.70 V, I
OH
= –11.2 mA 1.300 V
V
OH_LPDDR
5
High Level Output Voltage, ds = 01 V
DD_DMC
= 1.70 V, I
OH
= –7.85 mA 1.300 V
V
OH_LPDDR
6
High Level Output Voltage, ds = 10 V
DD_DMC
= 1.70 V, I
OH
= –5.10 mA 1.300 V
V
OH_LPDDR
7
High Level Output Voltage, ds = 11 V
DD_DMC
= 1.70 V, I
OH
= –2.55 mA 1.300 V
V
OL
8
Low Level Output Voltage V
DD_EXT
= 1 . 7 V, I
OL
= 2.0 mA 0.400 V
V
OL
8
Low Level Output Voltage V
DD_EXT
= 3.13 V, I
OL
= 2.0 mA 0.400 V
V
OL_DDR2
2
Low Level Output Voltage, ds = 00 V
DD_DMC
= 1.70 V, I
OL
13.4 mA 0.312 V
V
OL_DDR2
3
Low Level Output Voltage, ds = 10 V
DD_DMC
= 1.70 V, I
OL
= 6.70 mA 0.390 V
V
OL_LPDDR
4
Low Level Output Voltage, ds = 00 V
DD_DMC
= 1.70 V, I
OL
= 11.2 mA 0.400 V
V
OL_LPDDR
5
Low Level Output Voltage, ds = 01 V
DD_DMC
= 1.70 V, I
OL
= 7.85 mA 0.400 V
V
OL_LPDDR
6
Low Level Output Voltage, ds = 10 V
DD_DMC
= 1.70 V, I
OL
= 5.10 mA 0.400 V
V
OL_LPDDR
7
Low Level Output Voltage, ds = 11 V
DD_DMC
= 1.70 V, I
OL
= 2.55 mA 0.400 V
I
IH
9
High Level Input Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 3.47 V
10 μA
I
IH_PD
10
High Level Input Current with Pull-
down Resistor
V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 3.47 V
110 μA
I
IL
11
Low Level Input Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 0 V
10 μA
I
IL_PU
12
Low Level Input Current with Pull-up
Resistor
V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 0 V
100 μA
I
IH_USB0
13
High Level Input Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 3.47 V
240 μA
I
IL_USB0
13
Low Level Input Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 0 V
100 μA
I
OZH
14
Three-State Leakage Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 3.47 V
10 μA
I
OZH
15
Three-State Leakage Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 1.9 V
10 μA
I
OZL
16
Three-State Leakage Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 0 V
10 μA
I
OZL_PU
17
Three-State Leakage Current with
Pull-up Resistor
V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 0 V
100 μA
I
OZH_TWI
18
Three-State Leakage Current V
DD_EXT
= 3.47 V, V
DD_DMC
= 1.9 V, V
DD_
USB
= 3.47 V, V
IN
= 5.5 V
10 μA
C
IN
19,
20
Input Capacitance T
AMBIENT
= 25°C 4.9 6.7 pF
C
IN_TWI
18,
20
Input Capacitance T
AMBIENT
= 25°C 8.9 9.9 pF
C
IN_DDR
20,
21
Input Capacitance T
AMBIENT
= 25°C 5.8 6.6 pF
I
DD_TD
V
DD_TD
Current V
DD_TD
= 3.3 V 1 μA
I
DD_DEEPSLEEP
22,
23
V
DD_INT
Current in Deep Sleep Mode f
CCLK
= 0 MHz
f
SCLK0/1
= 0 MHz
Table 21 on
Page 57
mA