Datasheet
Table Of Contents
- Blackfin Dual Core Embedded Processor
- Features
- Memory
- Table Of Contents
- Revision History
- General Description
- ADSP-BF60x Detailed Signal Descriptions
- 349-Ball CSP_BGA Signal Descriptions
- GP I/O Multiplexing for 349-Ball CSP_BGA
- ADSP-BF60x Designer Quick Reference
- Specifications
- Operating Conditions
- Electrical Characteristics
- Processor — Absolute Maximum Ratings
- ESD Sensitivity
- Processor — Package Information
- Timing Specifications
- Clock and Reset Timing
- Power-Up Reset Timing
- Asynchronous Read
- Asynchronous Flash Read
- Asynchronous Page Mode Read
- Synchronous Burst Flash Read
- Asynchronous Write
- Asynchronous Flash Write
- All Accesses
- Bus Request/Bus Grant
- DDR2 SDRAM Clock and Control Cycle Timing
- DDR2 SDRAM Read Cycle Timing
- DDR2 SDRAM Write Cycle Timing
- Mobile DDR SDRAM Clock and Control Cycle Timing
- Mobile DDR SDRAM Read Cycle Timing
- Mobile DDR SDRAM Write Cycle Timing
- Enhanced Parallel Peripheral Interface Timing
- Link Ports
- Serial Ports
- Serial Peripheral Interface (SPI) Port—Master Timing
- Serial Peripheral Interface (SPI) Port—Slave Timing
- Serial Peripheral Interface (SPI) Port—SPI_RDY Slave Timing
- Serial Peripheral Interface (SPI) Port—Open Drain Mode Timing
- Serial Peripheral Interface (SPI) Port—SPI_RDY Timing
- General-Purpose Port Timing
- Timer Cycle Timing
- Up/Down Counter/Rotary Encoder Timing
- Pulse Width Modulator (PWM) Timing
- ADC Controller Module (ACM) Timing
- Universal Asynchronous Receiver-Transmitter (UART) Ports—Receive and Transmit Timing
- CAN Interface
- Universal Serial Bus (USB) On-The-Go—Receive and Transmit Timing
- RSI Controller Timing
- 10/100 Ethernet MAC Controller Timing
- JTAG Test And Emulation Port Timing
- Output Drive Currents
- Environmental Conditions
- ADSP-BF60x 349-Ball CSP_BGA Ball Assignments
- Outline Dimensions
- Automotive Products
- Ordering Guide

Rev. 0 | Page 52 of 112 | June 2013
ADSP-BF606/ADSP-BF607/ADSP-BF608/ADSP-BF609
SPECIFICATIONS
For information about product specifications please contact
your ADI representative.
OPERATING CONDITIONS
Parameter Conditions Min Nominal Max Unit
V
DD_INT
Internal Supply Voltage CCLK ≤ 500 MHz 1.19 1.25 1.32 V
V
DD_EXT
1
1
Must remain powered (even if the associated function is not used).
External Supply Voltage 1.7 1.8 1.9 V
V
DD_EXT
1
External Supply Voltage 3.13 3.3 3.47 V
V
DD_DMC
DDR2/LPDDR Supply Voltage 1.7 1.8 1.9 V
V
DD_USB
2
2
If not used, connect to 1.8 V or 3.3 V.
USB Supply Voltage 3.13 3.3 3.47 V
V
DD_TD
Thermal Diode Supply Voltage 3.13 3.3 3.47 V
V
IH
3
3
Parameter value applies to all input and bidirectional signals except TWI signals, DMC0 signals and USB0 signals.
High Level Input Voltage V
DD_EXT
= 3.47 V 2.1 V
V
IH
3
High Level Input Voltage V
DD_EXT
= 1.9 V 0.7 × V
DD_EXT
V
V
IHTWI
4,
5
4
Parameter applies to TWI signals.
5
TWI signals are pulled up to V
BUSTWI
. See Table 16.
High Level Input Voltage V
DD_EXT
= Maximum 0.7 × V
VBUSTWI
V
VBUSTWI
V
V
IH_DDR2
6,
7
6
Parameter applies to DMC0 signals in DDR2 mode.
7
V
DDR_REF
is the voltage applied to pin V
REF_DMC
, nominally V
DD_DMC
/2.
V
DD_DMC
= 1.9 V V
DDR_REF
+ 0.25 V
V
IH_LPDDR
8
8
Parameter applies to DMC0 signals in LPDDR mode.
V
DD_DMC
= 1.9 V 0.8 × V
DD_DMC
V
V
ID_DDR2
9
9
Parameter applies to signals DMC0_CK, DMC0_CK, DMC0_LDQS, DMC0_LDQS, DMC0_UDQS, DMC0_UDQS when used in DDR2 differential input mode.
Differential Input Voltage V
IX
= 1.075 V 0.50 V
V
ID_DDR2
9
Differential Input Voltage V
IX
= 0.725 V 0.55 V
V
IL
3
Low Level Input Voltage V
DD_EXT
= 3.13 V 0.8 V
V
IL
3
Low Level Input Voltage V
DD_EXT
= 1.7 V 0.3 × V
DD_EXT
V
V
ILTWI
4,
5
Low Level Input Voltage V
DD_EXT
= Minimum 0.3 × V
VBUSTWI
V
V
IL_DDR2
6,
7
V
DD_DMC
= 1.7 V V
DDR_REF
– 0.25 V
V
IL_LPDDR
8
V
DD_DMC
= 1.7 V 0.2 × V
DD_DMC
V
T
J
Junction Temperature T
AMBIENT
= –40°C to +85°C –40 +105 °C
T
J
Junction Temperature T
AMBIENT
= –40°C to +105°C –40 +125 °C
Table 16. TWI_VSEL Selections and V
DD_EXT
/V
BUSTWI
V
DD_EXT
Nominal V
BUSTWI
Min V
BUSTWI
Nom V
BUSTWI
Max Unit
TWI000
1
1
Designs must comply with the V
DD_EXT
and V
BUSTWI
voltages specified for the default TWI_DT setting for correct JTAG boundary scan operation during reset.
3.300 3.135 3.300 3.465 V
TWI001 1.800 1.700 1.800 1.900 V
TWI011 1.800 3.135 3.300 3.465 V
TWI100 3.300 4.750 5.000 5.250 V