Datasheet

ADSP-BF592
Rev. B | Page 43 of 44 | July 2013
OUTLINE DIMENSIONS
Dimensions in Figure 45 are shown in millimeters.
Figure 45. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ
1
]
Very Thin Quad (CP-64-4)
Dimensions shown in millimeters
1
For information relating to the CP-64-4 package’s exposed pad, see the table endnotes on Page 41.
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
6.35
6.20 SQ
6.05
0.25 MIN
TOP VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.50
0.40
0.30
0.50
BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60
MAX
EXPOSED PAD
(BOTTOM VIEW)
SEATING
PLANE
PIN 1
INDICATOR
PIN 1
INDICATOR
0.30
0.23
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE LEAD ASSIGNMENT AND
SIGNAL DESCRIPTIONS
SECTIONS OF THIS DATA SHEET.