Datasheet

Rev. B | Page 40 of 44 | July 2013
ADSP-BF592
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
J
= junction temperature (°C)
T
CASE
= case temperature (°C) measured by customer at top cen-
ter of package.

JT
= from Table 32
P
D
= power dissipation (see Total Power Dissipation on Page 19
for the method to calculate P
D
)
Values of

JA
are provided for package comparison and printed
circuit board design considerations.

JA
can be used for a first
order approximation of T
J
by the equation:
where:
T
A
= ambient temperature (°C)
Values of

JC
are provided for package comparison and printed
circuit board design considerations when an external heat sink
is required.
Values of

JB
are provided for package comparison and printed
circuit board design considerations.
In Table 32, airflow measurements comply with JEDEC stan-
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Table 32. Thermal Characteristics
Parameter Condition Typical Unit
θ
JA
0 linear m/s air flow 23.5 °C/W
θ
JMA
1 linear m/s air flow 20.9 °C/W
θ
JMA
2 linear m/s air flow 20.2 °C/W
θ
JB
11.2 °C/W
θ
JC
9.5 °C/W
Ψ
JT
0 linear m/s air flow 0.21 °C/W
Ψ
JT
1 linear m/s air flow 0.36 °C/W
Ψ
JT
2 linear m/s air flow 0.43 °C/W
T
J
T
CASE

JT
P
D
+=
T
J
T
A

JA
P
D
+=