Datasheet

ADSP-BF561
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in Table 13 may cause perma-
nent damage to the device. These are stress ratings only.
Functional operation of the device at these or any other condi-
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Table 13. Absolute Maximum Ratings
Parameter Value
Internal (Core) Supply Voltage (V
DDINT
) –0.3 V to +1.42 V
External (I/O) Supply Voltage (V
DDEXT
) –0.5 V to +3.8 V
Input Voltage
1
–0.5 V to +3.8 V
Output Voltage Swing –0.5 V to V
DDEXT
+ 0.5 V
Load Capacitance
2
200 pF
Storage Temperature Range –65C to +150C
Junction Temperature Under Bias 125C
1
Applies to 100% transient duty cycle. For other duty cycles see Table 14.
2
For proper SDRAM controller operation, the maximum load capacitance is 50 pF
(at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,
CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.
Table 14. Maximum Duty Cycle for Input Transient Voltage
1
V
IN
Min (V) V
IN
Max (V)
2
Maximum Duty Cycle
–0.50 3.80 100%
–0.70 4.00 40%
–0.80 4.10 25%
–0.90 4.20 15%
–1.00 4.30 10%
1
Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0.
2
Only one of the listed options can apply to a particular design.
PACKAGE INFORMATION
The information presented in Figure 7 and Table 15 provides
details about the package branding for the Blackfin processors.
For a complete listing of product availability, see the Ordering
Guide on Page 63.
a
ADSP-BF561
tppZccc
vvvvvv.x n.n
y
yww country_of_origin
B
Figure 7. Product Information on Package
Table 15. Package Brand Information
Brand Key Field Description
t Temperature Range
pp Package Type
Z RoHS Compliant Part
ccc See Ordering Guide
vvvvvv.x Assembly Lot Code
n.n Silicon Revision
yyww Date Code
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary protection circuitry, damage
may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to
avoid
performance degradation or loss of functionality.
Rev. E | Page 22 of 64 | September 2009