Datasheet

ADSP-BF538/ADSP-BF538F
Rev. E | Page 57 of 60 | November 2013
OUTLINE DIMENSIONS
Dimensions in the outline dimensions figures are shown in
millimeters.
SURFACE-MOUNT DESIGN
Table 45 is provided as an aid to PCB design. For industry-stan-
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Figure 58. 316-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-316-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-275-MMAB-1.
WITH EXCEPTION TO BALL DIAMETER.
0.80
BSC
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
V
W
U
Y
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
16
17
18
19
20
15.20
BSC SQ
0.50
0.45
0.40
0.35 NOM
0.30 MIN
17.10
17.00 SQ
16.90
COPLANARITY
0.20
BOTTOM VIEW
DETAIL A
TOP VIEW
BALL DIAMETER
SEATING
PLANE
1.45
1.36
1.27
A1 BALL
CORNER
A1 BALL
CORNER
DETAIL A
1.08
1.01
0.94
Table 45. BGA Data for Use with Surface-Mount Design
Package Package Ball Attach Type Package Solder Mask Opening Package Ball Pad Size
316-Ball CSP_BGA (BC-316-2) Solder Mask Defined 0.40 mm diameter 0.50 mm diameter