Datasheet

Rev. I|Page 66 of 68 | July 2010
ADSP-BF534/ADSP-BF536/ADSP-BF537
SURFACE-MOUNT DESIGN
The following table is provided as an aid to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Package Package Ball Attach Type
Package Solder Mask
Opening Package Ball Pad Si ze
182-Ball CSP_BGA (BC-182) Solder Mask Defined 0.40 mm diameter 0.55 mm diameter
208-Ball CSP_BGA (BC-208-2) Solder Mask Defined 0.40 mm diameter 0.55 mm diameter