Datasheet

ADSP-BF534/ADSP-BF536/ADSP-BF537
Rev. I|Page 65 of 68 | July 2010
Figure 68. 208-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-208-2)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-205-AM WITH
EXCEPTION TO PACKAGE HEIGHT AND BALL DIAMETER.
0.80
BSC
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
15
14
17
16
19
1820
13
12
11
10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW
15.20
BSC SQ
A1 CORNER
INDEX AREA
COPLANARITY
0.12
DETAIL A
*
0.50
0.45
0.40
0.35 NOM
0.30 MIN
BALL
DIAMETER
TOP VIEW
A1 BALL
CORNER
DETAIL A
SEATING
PLANE
17.10
17.00 SQ
16.90
*
1.75
1.61
1.46
1.36
1.26
1.16