Datasheet

Rev. I|Page 64 of 68 | July 2010
ADSP-BF534/ADSP-BF536/ADSP-BF537
OUTLINE DIMENSIONS
Dimensions in Figure 67 and Figure 68 are shown in
millimeters.
Figure 67. 182-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-182)
Dimensions shown in millimeters
DETAIL A
DETAIL A
0.50
0.45
0.40
1.31
1.21
1.10
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14 13 12 11 10 8 7 6 3 2 1954
A1 CORNER
INDEX AREA
TOP VIEW BOTTOM VIEW
1.70 MAX
12.00 BSC SQ
(BALL
DIAMETER)
SEATING
PLANE
0.25 MIN
0.12
COPLANARITY
PIN A1
INDICATOR
LOCATION
NOTES:
0.80
BSC
TYP
1. COMPLIANT TO JEDEC STANDARD MO-205-AE,
EXCEPT FOR BALL DIAMETER.
2. CENTER DIMENSIONS ARE NOMINAL.
3. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES
10.40
BSC
SQ