Datasheet

Rev. D | Page 87 of 88 | July 2013
ADSP-BF522/ADSP-BF523/ADSP-BF524/ADSP-BF525/ADSP-BF526/ADSP-BF527
SURFACE-MOUNT DESIGN
Table 71 is provided as an aid to PCB design. For industry-stan-
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
AUTOMOTIVE PRODUCTS
The ADBF525W model is available with controlled manufactur-
ing to support the quality and reliability requirements of
automotive applications. Note that these automotive models
may have specifications that differ from the commercial models
and designers should review the product Specifications section
of this data sheet carefully. Only the automotive grade products
shown in Table 72 are available for use in automotive applica-
tions. Contact your local ADI account representative for specific
product ordering information and to obtain the specific auto-
motive Reliability reports for these models.
Table 71. Surface-Mount Design Supplement
Package Package Ball Attach Type
Package Solder Mask
Opening Package Ball Pad Size
289-Ball CSP_BGA Solder Mask Defined 0.26 mm diameter 0.35 mm diameter
208-Ball CSP_BGA Solder Mask Defined 0.40 mm diameter 0.50 mm diameter
Table 72. Automotive Products
Automotive Models
1, 2
Tempe rat ure
Range
3
Package Description
Package
Option
Instruction
Rate (Max)
ADBF525WBBCZ4xx –40°C to +85°C 208-Ball CSP_BGA BC-208-2 400 MHz
ADBF525WBBCZ5xx –40°C to +85°C 208-Ball CSP_BGA BC-208-2 533 MHz
ADBF525WYBCZxxx –40°C to +105°C 208-Ball CSP_BGA BC-208-2 For product details, please contact your
ADI account representative.
1
Z = RoHS Compliant Part.
2
The information indicated by x in the model number will be provided by your ADI account representative.
3
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions for ADSP-BF523/ADSP-BF525/
ADSP-BF527 Processors on Page 30 for junction temperature (T
J
) specification which is the only temperature specification.