Datasheet

ADSP-2191M
–42– REV. A
To ensure that the T
AMB
data sheet specification is not exceeded,
a heatsink and/or an air flow source may be used. A heatsink
should be attached to the ground plane (as close as possible to
the thermal pathways) with a thermal adhesive.
Where:
• T
AMB
= Ambient temperature (measured near top surface
of package)
• PD = Power dissipation in W (this value depends upon
the specific application; a method for calculating PD is
shown under Power Dissipation).
•θ
CA
= Value from Table 24.
• For the LQFP package: θ
JC
= 0.96°C/W
For the mini-BGA package: θ
JC
= 8.4°C/W
Figure 30. Typical Output Delay or Hold vs. Load
Capacitance (at Maximum Case Temperature)
LOAD CAPACITANCE – pF
–10
025050 100 150 200
30
20
10
0
O
U
T
P
U
T
D
E
L
A
Y
O
R
H
O
L
D
–
n
s
Table 24. θ
CA
Values
Airflow
(Linear Ft./Min.)
0 100 200 400 600
Airflow
(Meters/Second)
00.5123
LQFP:
θ
CA
(°C/W)
44.3 41.4 38.5 35.3 32.1
Mini-BGA:
θ
CA
(°C/W)
26 24 22 20.9 19.8
T
AMB
T
CASE
= PD θ
CA
×–