Datasheet

Rev. C | Page 74 of 76 | July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Figure 58. 100-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP
1
]
(SW-100-2)
Dimensions shown in millimeters
1
For information relating to the exposed pad on the SW-100-2 package, see the table endnote on Page 70.
Figure 59. 196-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-196-8)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BED-HD
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
EXPOSED
PAD
1
1
25
25
26
26
50
50
76 76100 100
75 75
51
51
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
PIN 1
16.20
16.00 SQ
15.80
14.20
14.00 SQ
13.80
6.00 BSC
SQ
12.00 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.15
0.05
0.08
COPLANARITY
7°
0°
0.20
0.09
VIEW A
ROTATED 90° CCW
1.45
1.40
1.35
VIEW A
1.60
MAX
SEATING
PLANE
0.75
0.60
0.45
1.00 REF
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
0.80
BSC
0.80
REF
0.70
REF
0.36
REF
A
B
C
D
E
F
G
910 811121314 7 564231
BOTTOM VIEW
10.40
BSC SQ
H
J
K
L
M
N
P
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.12
0.50
0.45
0.40
BALL DIAMETER
SEATING
PLANE
12.10
12.00 SQ
11.90
A1 BALL
CORNER
A1 BALL
CORNER
0.35 NOM
0.30 MIN
1.50
1.41
1.32
1.13
1.06
0.99