Datasheet

ADSP-21477/ADSP-21478/ADSP-21479
Rev. C | Page 73 of 76 | July 2013
OUTLINE DIMENSIONS
The processors are available in 88-lead LFCSP_VQ, 100-lead
LQFP_EP and 196-ball CSP_BGA RoHS compliant packages.
For package assignment by model, see Ordering Guide on
Page 76.
Figure 57. 88-Lead Lead Frame Chip Scale Package [LFCSP_VQ
1
]
(CP-88-5)
Dimensions Shown in Millimeters
1
For information relating to the exposed pad on the CP-88-5 package, see the table endnote on Page 68.
*
COMPLIANT TO JEDEC STANDARDS MO-220-VRRD
EXCEPT FOR MINIMUM THICKNESS AND LEAD COUNT.
1
22
66
45
23
44
88
67
0.50
0.40
0.30
0.30
0.23
0.18
10.50
REF
0.60 MAX
0.60
MAX
6.70
REF SQ
0.50
BSC
0.138~0.194 REF
12° MAX
SEATING
PLANE
TOP VIEW
EXPOSED PAD
BOTTOM VIEW
0.70
0.65
0.60
0.045
0.025
0.005
PIN 1
INDICATOR
12.10
12.00 SQ
11.90
11.85
11.75 SQ
11.65
PIN 1
INDICATOR
*
0.90
0.85
0.75
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08