Datasheet

Rev. C | Page 20 of 76 | July 2013
ADSP-21477/ADSP-21478/ADSP-21479
Table 12. Pin List, Power and Ground
Name Type Description
V
DD_INT
P Internal Power Supply.
V
DD_EXT
P I/O Power Supply.
V
DD_RTC
P Real-Time Clock Power Supply. When RTC is not used, this pin should be connected to V
DD_EXT
.
GND
1
G Ground.
V
DD_THD
P Thermal Diode Power Supply. When not used, this pin can be left floating.
1
The exposed pad is required to be electrically and thermally connected to GND. Implement this by soldering the exposed pad to a GND PCB land that is the same size as the
exposed pad. The GND PCB land should be robustly connected to the GND plane in the PCB for best electrical and thermal performance. See also 88-LFCSP_VQ Lead
Assignment on Page 68 and 100-LQFP_EP Lead Assignment on Page 70.