Datasheet
Rev. 0 | Page 70 of 72 | June 2010
ADSP-21469
AUTOMOTIVE PRODUCTS
The ADSP-21469W model is available with controlled manu-
facturing to support the quality and reliability requirements of
automotive applications. Note that automotive models may
have specifications that differ from commercial models and
designers should review the Specifications section of this data
sheet carefully. Only the automotive grade products shown in
Table 60 are available for use in automotive applications. Con-
tact your local ADI account representative for specific product
ordering information and to obtain the specific Automotive
Reliability reports for these models.
ORDERING GUIDE
Table 60. Automotive Products
Model
1
Temperature Range
2
On-Chip SRAM Package Description Package Option
AD21469WBBCZ3xx
3
–40°C to +85°C 5M bit 324-Ball Grid Array (CSP_BGA) BC-324-1
1
Z = RoHS compliant part.
2
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 17 for junction temperature (T
J
)
specification, which is the only temperature specification.
3
xx denotes silicon revision.
Model
1
1
Z = RoHS compliant part.
Temperature
Range
2
2
Referenced temperature is ambient temperature. The ambient temperature is not a specification. Please see Operating Conditions on Page 17 for junction temperature (T
J
)
specification, which is the only temperature specification.
On-Chip
SRAM
Processor Instruction
Rate (Max) Package Description
Package
Option
ADSP-21469KBCZ-3 0C to +70C 5M bit 400 MHz 324-Ball Grid Array (CSP_BGA) BC-324-1
ADSP-21469BBCZ-3 –40C to +85C 5M bit 400 MHz 324-Ball Grid Array (CSP_BGA) BC-324-1
ADSP-21469KBCZ-4 0C to +70C 5M bit 450 MHz 324-Ball Grid Array (CSP_BGA) BC-324-1