Datasheet

ADSP-21469
Rev. 0 | Page 69 of 72 | June 2010
OUTLINE DIMENSIONS
The ADSP-21469 processor is available in a 19 mm by 19 mm
CSP_BGA lead-free package.
SURFACE-MOUNT DESIGN
The following table is provided as an aid to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface-Mount Design and Land Pat-
tern Standard.
Figure 60. 324-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-324-1)
Dimensions shown in millimeters
*
COMPLIANT TO JEDEC STANDARDS MO-192-AAG-1 WITH
THE EXCEPTION TO PACKAGE HEIGHT.
1.00
BSC
1.00
REF
A
B
C
D
E
F
G
9
8
11
10
13
12
7
6
5
42
31
BOTTOM VIEW
17.00
BSC SQ
H
J
K
L
M
N
P
R
T
U
V
0.50 NOM
0.45 MIN
DETAIL A
TOP VIEW
DETAIL A
COPLANARITY
0.20
0.70
0.60
0.50
BALL DIAMETER
SEATING
PLANE
19.10
19.00 SQ
18.90
A1 BALL
CORNER
A1 BALL
CORNER
*
1.80
1.71
1.56
1.31
1.21
1.11
15
14
17
1618
Package Package Ball Attach Type
Package Solder Mask
Opening Package Ball Pad Size
324-Ball CSP_BGA (BC-324-1) Solder Mask Defined 0.43 mm diameter 0.6 mm diameter