Datasheet

Rev. F | Page 60 of 64 | October 2013
ADSP-21367/ADSP-21368/ADSP-21369
SURFACE-MOUNT DESIGN
Table 47 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Figure 52. 256-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
(BP-256)
Dimension shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-192-BAL-2
0.10 MIN
0.70
0.60
0.50
1.00
0.80
0.60
COPLANARITY
0.20
0.90
0.75
0.60
SEATING
PLANE
BALL DIAMETER
0.25 MIN
(4 )
DETAIL A
1.70 MAX
1.27
BSC
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1
3
5
7
9
11
1315
19
2
4
68
101214
16
1820
24.13
BSC SQ
BOTTOM
VIEW
A1 CORNER
INDEX AREA
TOP VIEW
27.00
BSC SQ
BALL A1
INDICATOR
DETAIL A
17
Table 47. BGA_ED Data for Use with Surface-Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
256-Lead Ball Grid Array BGA_ED
(BP-256)
Solder Mask Defined (SMD) 0.63 mm 0.73 mm