Datasheet
Rev. F | Page 2 of 64 | October 2013
ADSP-21367/ADSP-21368/ADSP-21369
TABLE OF CONTENTS
Summary ............................................................... 1
Dedicated Audio Components ................................. 1
General Description ................................................. 3
SHARC Family Core Architecture ............................ 4
Family Peripheral Architecture ................................ 7
I/O Processor Features ......................................... 10
System Design .................................................... 10
Development Tools ............................................. 11
Additional Information ........................................ 12
Related Signal Chains .......................................... 12
Pin Function Descriptions ....................................... 13
Specifications ........................................................ 16
Operating Conditions .......................................... 16
Electrical Characteristics ....................................... 17
Package Information ........................................... 18
ESD Caution ...................................................... 18
Maximum Power Dissipation ................................. 18
Absolute Maximum Ratings ................................... 18
Timing Specifications ........................................... 18
Output Drive Currents ......................................... 51
Test Conditions .................................................. 51
Capacitive Loading .............................................. 51
Thermal Characteristics ........................................ 53
256-Ball BGA_ED Pinout ......................................... 54
208-Lead LQFP_EP Pinout ....................................... 57
Package Dimensions ............................................... 59
Surface-Mount Design .......................................... 60
Automotive Products .............................................. 61
Ordering Guide ..................................................... 61
REVISION HISTORY
10/13—Rev. E to Rev. F
Updated Development Tools .....................................11
Added Related Signal Chains .....................................12
Corrected EMU
pin type from O/T(pu) to O(O/D, pu) in
Pin Function Descriptions ........................................13
Corrected Junction Temperature 256-Ball BGA Min Value at
ambient temperature (
–40°C to +85C) from 0 to –40 in
Operating Conditions ..............................................16
Added 400 MHz Min and Max values for Junction Temperature
208-Lead LQFP_EP at ambient temperature
0°C to +70C in
Operating Conditions ..............................................16
Added footnote 2 to Table 24 in Memory Read ..............30
Changed Max values in Table 34 in Pulse-Width Modulation
Generators ............................................................41
Updated timing parameters in Table 40 and in Figure 36 in
SPI Interface—Master ..............................................48
Updated Figure 37 in SPI Interface—Slave ....................49
Changes to Ordering Guide .......................................61
To view product/process change notifications (PCNs) related to
this data sheet revision, please visit the processor’s product page
on the www.analog.com website and use the View PCN link.