Datasheet

ADSP-21367/ADSP-21368/ADSP-21369
Rev. F | Page 59 of 64 | October 2013
PACKAGE DIMENSIONS
The ADSP-21367/ADSP-21368/ADSP-21369 processors are
available in 256-ball RoHS compliant and leaded BGA_ED, and
208-lead RoHS compliant LQFP_EP packages.
Figure 51. 208-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP]
(SW-208-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BJB-HD
100907 A
0.15
0.10
0.05
0.08
COPLANARITY
0.20
0.15
0.09
1.45
1.40
1.35
7°
3.5°
0°
VIEW A
ROTATED 90° CCW
0.27
0.22
0.17
0.75
0.60
0.45
0.50
BSC
LEAD PITCH
28.10
28.00 SQ
27.90
30.20
30.00 SQ
29.80
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
EXPOSED
PAD
1
52
53
52
53
105
104
105
104
156
208
1
208
157
156
157
PIN 1
1.60 MAX
1.00 REF
SEATING
PLANE
VIEW A
8.890
REF
8.712
REF
25.50
REF
NOTE:
THE EXPOSED PAD IS REQUIRED TO BE ELECTRICALLY AND THERMALLY CONNECTED TO VSS.
THIS SHOULD BE IMPLEMENTED BY SOLDERING THE EXPOSED PAD TO A VSS PCB LAND THAT IS THE SAME SIZE
AS THE EXPOSED PAD. THE VSS PCB LAND SHOULD BE ROBUSTLY CONNECTED TO THE VSS PLANE IN THE PCB
WITH AN ARRAY OF THERMAL VIAS FOR BEST PERFORMANCE.