Datasheet
Table Of Contents
- Summary
- Dedicated Audio Components
- Table of Contents
- Revision History
- General Description
- SHARC Family Core Architecture
- SIMD Computational Engine
- Independent, Parallel Computation Units
- Data Register File
- Context Switch
- Universal Registers
- Timer
- Single-Cycle Fetch of Instruction and Four Operands
- Instruction Cache
- Data Address Generators with Zero-Overhead Hardware Circular Buffer Support
- Flexible Instruction Set
- On-Chip Memory
- On-Chip Memory Bandwidth
- ROM-Based Security
- Family Peripheral Architecture
- I/O Processor Features
- System Design
- Development Tools
- Additional Information
- Related Signal Chains
- SHARC Family Core Architecture
- Pin Function Descriptions
- Specifications
- Operating Conditions
- Electrical Characteristics
- Package Information
- ESD Caution
- Maximum Power Dissipation
- Absolute Maximum Ratings
- Timing Specifications
- Core Clock Requirements
- Power-Up Sequencing
- Clock Input
- Clock Signals
- Reset
- Interrupts
- Core Timer
- Timer PWM_OUT Cycle Timing
- Timer WDTH_CAP Timing
- DAI Pin to Pin Direct Routing
- Precision Clock Generator (Direct Pin Routing)
- Flags
- Memory Read—Parallel Port
- Memory Write—Parallel Port
- Serial Ports
- Input Data Port (IDP)
- Parallel Data Acquisition Port (PDAP)
- Pulse-Width Modulation Generators
- Sample Rate Converter—Serial Input Port
- Sample Rate Converter—Serial Output Port
- S/PDIF Transmitter
- S/PDIF Receiver
- SPI Interface—Master
- SPI Interface—Slave
- JTAG Test Access Port and Emulation
- Output Drive Currents
- Test Conditions
- Capacitive Loading
- Thermal Characteristics
- 144-Lead LQFP_EP Pin Configurations
- 136-Ball BGA Pin Configurations
- Package Dimensions
- Automotive Products
- Ordering Guide
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Rev. J | Page 53 of 60 | July 2013
PACKAGE DIMENSIONS
The processor is available in 136-ball BGA and 144-lead
exposed pad (LQFP_EP) packages.
Figure 47. 144-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP
1
]
(SW-144-1)
Dimensions shown in millimeters
1
For information relating to the exposed pad on the SW-144-1 package, see the table endnote on Page 48.
COMPLIANT TO JEDEC STANDARDS MS-026-BFB-HD
0.27
0.22
0.17
0.75
0.60
0.45
0.50
BSC
LEAD PITCH
20.20
20.00 SQ
19.80
22.20
22.00 SQ
21.80
EXPOSED*
PAD
1
36
1
36
37
73
72
37
72
108
73
108
144
109
144
109
PIN 1
1.60 MAX
SEATING
PLANE
*
EXPOSED PAD IS COINCIDENT WITH BOTTOM SURFACE AND
DOES NOT PROTRUDE BEYOND IT. EXPOSED PAD IS CENTERED.
8.80 SQ
0.15
0.10
0.05
0.08
COPLANARITY
0.20
0.15
0.09
1.45
1.40
1.35
7°
3.5°
0°
VIEW A
ROTATED 90° CCW
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
VIEW A