Datasheet

ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Rev. J | Page 47 of 60 | July 2013
THERMAL CHARACTERISTICS
The processor is rated for performance over the temperature
range specified in Operating Conditions on Page 14.
Table 42 through Table 44 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA) and JESD51-5 (LQFP_EP). The junction-to-case mea-
surement complies with MIL-STD-883. All measurements use a
2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
Industrial applications using the LQFP_EP package require
thermal trace squares and thermal vias, to an embedded ground
plane, in the PCB. Refer to JEDEC standard JESD51-5 for more
information.
To determine the junction temperature of the device while on
the application PCB, use:
where:
T
J
= junction temperature (°C)
T
T
= case temperature (°C) measured at the top center of the
package
Ψ
JT
= junction-to-top (of package) characterization parameter
is the typical value from Table 42 through Table 44.
P
D
= power dissipation. See the Engineer-to-Engineer Note
“Estimating Power for the ADSP-21362 SHARC Processors”
(EE-277) for more information.
Values of θ
JA
are provided for package comparison and PCB
design considerations.
Values of θ
JC
are provided for package comparison and PCB
design considerations when an exposed pad is required. Note
that the thermal characteristics values provided in Table 42
through Table 44 are modeled values.
Figure 42. Typical Output Delay or Hold versus Load Capacitance
(at Ambient Temperature)
LOAD CAPACITANCE (pF)
0 20050 100 150
10
8
O
U
T
P
U
T
D
E
L
A
Y
O
R
H
O
L
D
(
n
s
)
6
0
4
2
- 2
y=0.0488x - 1.5923
- 4
T
J
T
T

JT
P
D
+=
Table 42. Thermal Characteristics for BGA (No Thermal vias
in PCB)
Parameter Condition Typical Unit
θ
JA
Airflow = 0 m/s 25.40 °C/W
θ
JMA
Airflow = 1 m/s 21.90 °C/W
θ
JMA
Airflow = 2 m/s 20.90 °C/W
θ
JC
5.07 °C/W
Ψ
JT
Airflow = 0 m/s 0.140 °C/W
Ψ
JMT
Airflow = 1 m/s 0.330 °C/W
Ψ
JMT
Airflow = 2 m/s 0.410 °C/W
Table 43. Thermal Characteristics for BGA (Thermal vias in
PCB)
Parameter Condition Typical Unit
θ
JA
Airflow = 0 m/s 23.40 °C/W
θ
JMA
Airflow = 1 m/s 20.00 °C/W
θ
JMA
Airflow = 2 m/s 19.20 °C/W
θ
JC
5.00 °C/W
Ψ
JT
Airflow = 0 m/s 0.130 °C/W
Ψ
JMT
Airflow = 1 m/s 0.300 °C/W
Ψ
JMT
Airflow = 2 m/s 0.360 °C/W
Table 44. Thermal Characteristics for LQFP_EP (with
Exposed Pad Soldered to PCB)
Parameter Condition Typical Unit
θ
JA
Airflow = 0 m/s 16.80 °C/W
θ
JMA
Airflow = 1 m/s 14.20 °C/W
θ
JMA
Airflow = 2 m/s 13.50 °C/W
θ
JC
7.25 °C/W
Ψ
JT
Airflow = 0 m/s 0.51 °C/W
Ψ
JMT
Airflow = 1 m/s 0.72 °C/W
Ψ
JMT
Airflow = 2 m/s 0.80 °C/W