Datasheet

Rev. 0 | Page 44 of 44 | March 2006
ADSP-21261
© 2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04932-0-3/06(0)
SURFACE MOUNT DESIGN
Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
ORDERING GUIDE
Table 36. BGA Data for Use with Surface Mount Design
Package
Ball Attach
Type
Solder Mask
Opening
Ball Pad
Size
136-Ball Mini-BGA
(BC-136-3)
Solder Mask
Defined
0.40 mm
diameter
0.53 mm
diameter
Model
Temperature
Range
1
1
Ranges shown represent ambient temperature.
Instruction
Rate
On-Chip
SRAM ROM
Operating
Voltage
Package
Description
Package
Option
ADSP-21261SKBC-150 0°C to +70°C 150 MHz 1M bit 3M bit 1.2 V Internal
3.3 V External
136-Ball BGA BC-136-3
ADSP-21261SKBCZ150
2
2
Z = Pb-free part.
0°C to +70°C 150 MHz 1M bit 3M bit 1.2 V Internal
3.3 V External
136-Ball BGA BC-136-3
ADSP-21261SKSTZ150
2
0°C to +70°C 150 MHz 1M bit 3M bit 1.2 V Internal
3.3 V External
144-Lead LQFP ST-144-2