Datasheet

Rev. C | Page 58 of 60 | January 2013
ADSP-21161N
OUTLINE DIMENSIONS
The ADSP-21161N comes in a 17 mm  17 mm, 225-ball
CSP_BGA package with 15 rows of balls.
SURFACE-MOUNT DESIGN
Table 41 is provided as an aid to PCB design. For industry stan-
dard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
ORDERING GUIDE
Figure 42. 225-Ball CSP_BGA (BC-225-1)
*
COMPLIANT TO JEDEC STANDARDS MO-192-AAF-2
WITH THE EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
0.50
REF
17.20
17.00 SQ
16.80
BALL DIAMETER
COPLANARITY
0.20
1.00
BSC
14.00
BSC SQ
DETAIL A
A1 BALL
CORNER
A1 BALL
CORNER
DETAIL A
BOTTOM VIEW
TOP VIEW
SEATING
PLANE
0.70
0.60
0.50
0.54
0.50
0.30
*
1.31
1.21
1.10
*
1.85
1.71
1.40
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
Table 41. BGA Data for Use with Surface-Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
225-Ball CSP_BGA (BC-225-1) Solder Mask Defined 0.40 mm diameter 0.53 mm diameter
Model
1
1
Z = RoHS Compliant Part.
Temperature Range
2
2
Referenced temperature is case temperature.
Instruction Rate
On-Chip
SRAM
Package
Description
Package
Option
ADSP-21161NKCA-100 0C to 85C 100 MHz 1M bit 225-Ball CSP_BGA BC-225-1
ADSP-21161NCCA-100 –40C to +105C 100 MHz 1M bit 225-Ball CSP_BGA BC-225-1
ADSP-21161NKCAZ100 0C to 85C 100 MHz 1M bit 225-Ball CSP_BGA BC-225-1
ADSP-21161NCCAZ100 –40C to +105C 100 MHz 1M bit 225-Ball CSP_BGA BC-225-1
ADSP-21161NYCAZ110 –40C to +125C 110 MHz 1M bit 225-Ball CSP_BGA BC-225-1