Datasheet

Rev. F | Page 60 of 64 | March 2008
ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
SURFACE-MOUNT DESIGN
Table 43 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Figure 45. 240-Lead Ceramic Quad Flat Package, Mounted with Cavity Up [CQFP]
(QS-240-1B)
Dimensions shown in millimeters
65.90
BSC
75.50 BSC SQ
121
180
181
240
1
60
120
61
INDEX 1
GOLD
PLATED
29.50 BSC
LID
SEAL RING
TOP VIEW
75.00 BSC SQ
2.60
2.55
2.50
3.60
3.55
3.50
29.50
BSC
1
240 181
180
121
120
BOTTOM VIEW
HEAT SLUG
60
61
INDEX 2
2.00 DIA
NO GOLD
NONCONDUCTIVE
CERAMIC TIE BAR
70.00 BSC SQ
2.05
SIDE VIEW
0.50
0.90
0.80
0.70
3.42
3.17
2.92
1.22 (4×)
16.50 (8×)
Table 43. BGA Data for Use with Surface-Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
225-Ball Grid Array (PBGA) Solder Mask Defined 0.63 mm diameter 0.76 mm diameter