Datasheet

Data Sheet ADPD1080/ADPD1081
Rev. B | Page 73 of 74
OUTLINE DIMENSIONS
2.70
2.60 SQ
2.50
0.80
0.75
0.70
TOP VIEW
SIDE VIEW
EXPOSED
PAD
BOTTOM VIEW
PKG-003523
1
0.40
BSC
28
8
14
15
21
22
7
0.45
0.40
0.35
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.25
0.20
0.15
COMPLIANT TO JEDEC STANDARDS MO-220-WGGE
4.10
4.00 SQ
3.90
09-10-2018-B
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PIN 1
IN DIC
ATO R AR E A OP TIO NS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
SEATING
PLANE
PIN 1
INDICATOR
AREA
Figure 56. 28-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-28-5)
Dimensions shown in millimeters
BOTTOM VIEW
(BALL SIDE UP)
A
B
C
D
E
F
0.560
0.500
0.440
1.44
1.40
1.36
2.50
2.46
2.42
1
2
3
0.300
0.260
0.220
0.40
BSC
0.300
0.225
0.235
2.00
REF
BALL A1
IDENTIFIER
02-03-2015-B
SEATING
PLANE
0.230
0.200
0.170
0.330
0.300
0.270
COPLANARITY
0.05
TOP VIEW
(BALL SIDE DOWN)
END VIEW
PKG-004659
Figure 57. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-18)
Dimensions shown in millimeters
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