Datasheet

Data Sheet ADPD1080/ADPD1081
Rev. B | Page 13 of 74
ABSOLUTE MAXIMUM RATINGS
Table 8. ADPD1080 Absolute Maximum Rating
Parameter Rating
AVDD to AGND −0.3 V to +2.2 V
DVDD to AGND (LFCSP Only) −0.3 V to +2.2 V
GPIOx to AGND (LFCSP Only) −0.3 V to +2.2 V
DVDD to DGND (WLCSP Only) −0.3 V to +2.2 V
GPIOx to DGND (WLCSP Only) −0.3 V to +2.2 V
LEDXx to LGND −0.3 V to +3.6 V
SCL, SDA to DGND −0.3 V to +3.9 V
Junction Temperature 150°C
Electrostatic Discharge (ESD)
Human Body Model (HBM) 1500 V
Charged Device Model (CDM) 500 V
Machine Model (MM) 100 V
Table 9. ADPD1081 Absolute Maximum Rating
Parameter Rating
VDD to AGND −0.3 V to +2.2 V
VDD to DGND −0.3 V to +2.2 V
GPIOx, MOSI, MISO, SCLK,
CS
to DGND
−0.3 V to +2.2 V
LEDXx to LGND −0.3 V to +3.6 V
Junction Temperature 150°C
Electrostatic Discharge (ESD)
Human Body Model (HBM) 1500 V
Charged Device Model (CDM) 500 V
Machine Model (MM) 100 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Close attention to
PCB thermal design is required.
θ
JA
is the junction to ambient thermal resistance value, and θ
JC
is
the junction to case thermal resistance value.
Table 10. Thermal Resistance
Package Type
1
θ
JA
θ
JC
Unit
CP-28-5 (28-Lead LFCSP) 54.9 5.3 °C/W
CB-16-18 (16-Ball WLCSP) 60 0.5 °C/W
CB-17-1 (17-Ball WLCSP) 60 0.5 °C/W
1
Thermal impedance simulated values are based on a JEDEC 2S2P board and
2 thermal vias. See JEDEC JESD-51.
RECOMMENDED SOLDERING PROFILE
Figure 5 and Table 11 provide details about the recommended
soldering profile.
P
L
25°C TO PEAK
t
S
PREHEAT
CRITICAL ZONE
T
L
TO T
P
TEMPERATURE
TIME
RAMP-UP
SMIN
T
SMAX
P
L
16110-005
Figure 5. Recommended Soldering Profile
Table 11. Recommended Soldering Profile
Profile Feature Condition (Pb-Free)
Average Ramp Rate (T
L
to T
P
) 3°C/sec max
Preheat
Minimum Temperature (T
SMIN
) 150°C
Maximum Temperature (T
SMAX
) 200°C
Time (T
SMIN
to T
SMAX
) (t
S
) 60 sec to 180 sec
T
SMAX
to T
L
Ramp-Up Rate 3°C/sec maximum
Time Maintained Above Liquidous
Temperature
Liquidous Temperature (T
L
) 217°C
Time (t
L
) 60 sec to 150 sec
Peak Temperature (T
P
) +260 (+0/−5)°C
Time Within 5°C of Actual Peak
Temperature (t
P
)
<30 sec
Ramp-Down Rate 6°C/sec maximum
Time from 25°C to Peak Temperature 8 minutes maximum
ESD CAUTION
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