Datasheet

ADP8870
Rev. Sp0 | Page 2 of 2
OUTLINE DIMENSIONS
110609-A
A
B
C
D
E
2.395
2.355
2.315
2.190
2.150
2.1 10
1
23
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL 1
IDENTIFIER
0.40
REF
0.645
0.600
0.555
SIDE VIEW
0.230
0.200
0.170
0.287
0.267
0.247
1.60 REF
1.20 REF
COPLANARITY
0.05
SEATING
PLANE
0.415
0.400
0.385
Figure 2. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-7)
Dimensions shown in millimeters
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.20
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
061609-B
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
Figure 3. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-10)
Dimensions shown in millimeters
08829-031
Figure 4. Tape and Reel Orientation for WLCSP Units
08829-032
Figure 5. Tape and Reel Orientation for LFCSP Units
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registered trademarks are the property of their respective owners.
D08829F-0-6/10(Sp0)