Datasheet

Data Sheet ADP8866
Rev. A | Page 5 of 52
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, VOUT to GND −0.3 V to +6 V
D1, D2, D3, D4, D5, D6, D7, D8, and D9 to
GND
−0.3 V to +6 V
nINT, nRST, SCL, and SDA to GND −0.3 V to +6 V
Output Short-Circuit Duration Indefinite
Operating Ambient Temperature Range −40°C to +85°C
1
Operating Junction Temperature Range −40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Soldering Conditions JEDEC J-STD-020
ESD (Electrostatic Discharge)
Human Body Model (HBM) ±2.0 kV
Charged Device Model (CDM) ±1.5 kV
1
The maximum operating junction temperature (T
J(MAX)
) supersedes the
maximum operating ambient temperature (T
A(MAX)
). See the Maximum
Temperature Ranges section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational section of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to GND.
MAXIMUM TEMPERATURE RANGES
The maximum operating junction temperature (T
J(MAX)
)
supersedes the maximum operating ambient temperature
(T
A(MAX)
). Therefore, in situations where the ADP8866 is
exposed to poor thermal resistance and a high power dissipation
(P
D
), the maximum ambient temperature may need to be derated.
In these cases, the ambient temperature maximum can be
calculated with the following equation:
T
A(MAX)
= T
J(MAX)
− (θ
JA
× P
D(MAX)
).
THERMAL RESISTANCE
The θ
JA
(junction to air) and θ
JC
(junction to case) are
determined according to JESD51-9 on a 4-layer printed circuit
board (PCB) with natural convection cooling. The exposed pad
must be soldered to GND.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
LFCSP
38.6
3.56
°C/W
ESD CAUTION