Datasheet

ADP8863
Rev. A | Page 5 of 52
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, VOUT −0.3 V to +6 V
D1, D2, D3, D4, D5, D6, and D7 −0.3 V to +6 V
CMP_IN −0.3 V to +6 V
nINT, nRST, SCL, and SDA −0.3 V to +6 V
Output Short-Circuit Duration Indefinite
Operating Ambient Temperature Range –40°C to +85°C
1
Operating Junction Temperature Range –40°C to +125°C
Storage Temperature Range –65°C to +150°C
Soldering Conditions JEDEC J-STD-020
ESD (Electrostatic Discharge)
Human Body Model (HBM) ±3 kV
Charged Device Model (CDM) ±1.5 kV
1
The maximum operating junction temperature (T
J(MAX)
) takes precedence
over the maximum operating ambient temperature (T
A(MAX)
). See the
Maximum Temperature Ranges section for more information.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to ground.
MAXIMUM TEMPERATURE RANGES
The maximum operating junction temperature (T
J(MAX)
) takes
precedence over the maximum operating ambient temperature
(T
A(MAX)
). Therefore, in situations where the ADP8863 is
exposed to poor thermal resistance and high power dissipation
(P
D
), the maximum ambient temperature may need to be
derated. In these cases, the maximum ambient temperature can
be calculated with the following equation:
T
A(MAX)
= T
J(MAX)
− (θ
JA
× P
D(MAX)
)
THERMAL RESISTANCE
θ
JA
(junction to air) is specified for the worst-case conditions,
that is, a device soldered in a circuit board for surface-mount
packages. The θ
JA
, θ
JB
(junction to board), and θ
JC
(junction to case)
are determined according to JESD51-9 on a 4-layer printed
circuit board (PCB) with natural convection cooling. For the
LFCSP package, the exposed pad must be soldered to GND.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JB
θ
JC
Unit
WLCSP 48 9 N/A
1
°C/W
LFCSP 49.5 N/A
1
5.3 °C/W
1
N/A stands for not applicable.
ESD CAUTION