Datasheet

ADP8861 Data Sheet
Rev. B | Page 40 of 40
A
B
C
D
E
2.395
2.355
2.315
1.995
1.955
1.915
1
23
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.40
REF
0.645
0.600
0.555
SIDE VIEW
0.230
0.200
0.170
0.287
0.267
0.247
1.60 REF
1.20 REF
COPLANARITY
0.04
SEATING
PLANE
0.415
0.400
0.385
04-24-2012-A
Figure 46. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-6)
Dimensions shown in millimeters
08391-033
DIRECTION OF FEED
Figure 47. Tape and Reel Orientation for WLCSP Units
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADP8861ACPZ-RL −40°C to +85°C 20-Lead LFCSP_WQ, 13” Tape and Reel CP-20-10
ADP8861ACBZ-R7 −40°C to +85°C 20-Ball WLCSP, 7” Tape and Reel CB-20-6
ADP8861DBCB-EVALZ Daughter Card
ADP886XMB1-EVALZ USB-to-I
2
C Adapter Board
1
Z = RoHS Compliant Part.
I
2
C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
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D08391-0-4/12(B)