Datasheet

Data Sheet ADP8861
Rev. B | Page 39 of 40
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.20
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
061609-B
BOTTOMVIEWTOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NO
M
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.65
2.50 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5
Figure 44. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-10)
Dimensions shown in millimeters
08391-203
Figure 45. Tape and Reel Orientation for LFCSP Units