Datasheet

ADP8860
Rev. 0 | Page 49 of 52
OUTLINE DIMENSIONS
0.645
0.600
0.555
1.995
1.955
1.915
A
B
C
D
E
1
2
3
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.287
0.267
0.247
1.60
REF
SEATING
PLANE
0.40
REF
0.415
0.400
0.385
0.230
0.200
0.170
0.05 MAX
COPLANARITY
2.395
2.355
2.315
BALL A1
IDENTIFIER
021009-A
Figure 47. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-6)
Dimensions shown in millimeters
2.65
2.50 SQ
2.35
3.75
BSC SQ
4.00
BSC SQ
1
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
090408-B
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDI
C
ATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
20
6
16
10
11
15
5
EXPOSED
PAD
(BOTTOM VIEW)
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 48. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters