Datasheet
ADP7102 Data Sheet
Rev. C | Page 6 of 28
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
NOTES
1. NC = NO CONNE
C
T. DO NOT CONNECT TO
THIS PIN.
2
. IT IS HIGHLY RECOMMENDED THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNECTED TO THE GROUND
PLANE ON THE BOARD.
3GND
4NC
1VOUT
2SENSE/ADJ
6GND
5 EN/UVLO
8VIN
7PG
ADP7102
TOP VIEW
(Not to Scale)
09506-003
Figure 3. LFCSP Package
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO
THIS PIN.
2. IT IS HIGHLY RECOMMENDED THAT THE
EXPOSED PAD ON THE BOTTOM OF THE
PACKAGE BE CONNECTED TO THE GROUND
PLANE ON THE BOARD.
VOUT
1
SENSE/ADJ
2
GND
3
NC
4
VIN
8
PG
7
GND
6
EN/UVLO
5
ADP7102
TOP VIEW
(Not to Scale)
09506-104
Figure 4. Narrow Body SOIC Package
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 VOUT Regulated Output Voltage. Bypass VOUT to GND with a 1 μF or greater capacitor.
2 SENSE/ADJ
Sense (SENSE). Measures the actual output voltage at the load and feeds it to the error amplifier.
Connect SENSE as close as possible to the load to minimize the effect of IR drop between the
regulator output and the load. This function applies to fixed voltages only.
Adjust Input (ADJ). An external resistor divider sets the output voltage. This function applies to
adjustable voltages only.
3 GND Ground.
4 NC Do Not Connect to this Pin.
5 EN/UVLO
Enable Input (EN). Drive EN high to turn on the regulator; drive EN low to turn off the regulator.
For automatic startup, connect EN to VIN.
Programmable Undervoltage Lockout (UVLO). When the programmable UVLO function is used,
the upper and lower thresholds are determined by the programming resistors.
6 GND Ground.
7 PG
Power Good. This open-drain output requires an external pull-up resistor to VIN or VOUT. If the
part is in shutdown, current limit, thermal shutdown, or falls below 90% of the nominal output
voltage, PG immediately transitions low. If the power good function is not used, the pin may be
left open or connected to ground.
8 VIN Regulator Input Supply. Bypass VIN to GND with a 1 μF or greater capacitor.
EPAD
Exposed Pad. Exposed paddle on the bottom of the package. The EPAD enhances thermal
performance and is electrically connected to GND inside the package. It is highly recommended
that the EPAD be connected to the ground plane on the board.