Datasheet

Data Sheet ADP7102
Rev. C | Page 23 of 28
In the case where the board temperature is known, use the
thermal characterization parameter, Ψ
JB
, to estimate the
junction temperature rise (see Figure 77 and Figure 78).
Maximum junction temperature (T
J
) is calculated from
the board temperature (T
B
) and power dissipation (P
D
)
using the following formula:
T
J
= T
B
+ (P
D
× Ψ
JB
) (5)
The typical value of Ψ
JB
is 15.1°C/W for the 8-lead LFCSP
package and 31.3°C/W for the 8-lead SOIC package.
T
OTA
L POWER DISSIPA
TION (W)
JUNCTION TEMPERATURE (T
J
)
0
20
40
60
80
100
120
140
0 0.5 1.0 1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0 5.5
6.0
6.5 7.0
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
T
J
MAX
09506-072
Figure 77. LFCSP
TOTAL POWER DISSIPATION (W)
JUNCTION TEMPERATURE (T
J
)
0
20
40
60
80
100
120
140
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
T
J
MAX
09506-073
Figure 78. SOIC