Datasheet
Data Sheet ADP5587
Rev. D | Page 23 of 24
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.20
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGD-8.
072809A
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
2.20
2.10 SQ
2.00
Figure 21. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-10)
Dimensions shown in millimeters
092209-B
A
B
C
D
E
0.645
0.600
0.555
0.230
0.200
0.170
2.010
1.970 SQ
1.930
1
2
3
45
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
0.287
0.267
0.247
SEATING
PLANE
COPLANARITY
0.05
0.40
REF
1.60
REF SQ
0.022
REF
0.395
0.375
0.355
BALL A1
IDENTIFIER
Figure 22. 25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature
Range
I
2
C Write
Address
Package Description
Package
Option Write Read
ADP5587ACPZ-R7
−40°C to +85°C
0x68
0x69
24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
CP-24-10
ADP5587ACPZ-1-R7 −40°C to +85°C 0x60 0x61 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-24-10
ADP5587ACBZ-R7 −40°C to +85°C 0x68 0x69 25-Ball Wafer Level Chip Scale Package [WLCSP] CB-25-4
ADP5587CP-EVALZ 0x68 0x69 Evaluation Board [LFCSP_WQ] CP-24-10
ADP5587CB-EVALZ 0x68 0x69 Evaluation Board [WLCSP] CB-25-4
1
Z = RoHS Compliant Part.