Datasheet

ADP5062 Data Sheet
Rev. B | Page 8 of 44
ABSOLUTE MAXIMUM RATINGS
Table 4. Absolute Maximum Ratings
Parameter Rating
VIN1, VIN2, VIN3 to AGND –0.5 V to +20 V
All Other Pins to AGND –0.3 V to +6 V
Continuous Drain Current, Battery Supple-
mentary Mode, from ISO_Bx to ISO_Sx
2.1 A
Storage Temperature Range –65°C to +150°C
Operating Junction Temperature Range –40°C to +125°C
Soldering Conditions JEDEC J-STD-020
THERMAL RESISTANCE

JA
is specified for the worst-case conditions, that is, 
JA
is
specified for a device soldered in a circuit board for surface-
mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
20-Lead LFCSP 35.6 3.65 °C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADP5062 package
is limited by the associated rise in junction temperature (T
J
) on
the die. At a die temperature of approximately 150°C (the glass
transition temperature), the properties of the plastic change.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, thereby perma-
nently shifting the parametric performance of the ADP5062.
Exceeding a junction temperature of 175°C for an extended
period can result in changes in the silicon devices, potentially
causing failure.
ESD CAUTION
Stresses abo
v
ethose listedunderAbsoluteMaximumRatings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximumratingconditionsfor extendedperiodsmayaffect
de
v
ice reliability.