Datasheet

Data Sheet ADP5062
Rev. B | Page 43 of 44
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 42. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range (Junction) Package Description Package Option
ADP5062ACPZ-1-R7 –40°C to +125°C 20-Lead LFCSP_WQ CP-20-8
ADP5062ACPZ-2-R7 –40°C to +125°C 20-Lead LFCSP_WQ CP-20-8
ADP5062CP-EVALZ ADP5062 Evaluation Board
1
Z = RoHS Compliant Part.
2
For additional factory-programmable options, contact an Analog Devices local sales or distribution representative.
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD.
020509-B
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.75
2.60 SQ
2.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
1
20
6
10
11
15
16
5