Datasheet

ADP5061 Data Sheet
Rev. C | Page 42 of 44
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
Figure 42. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1, 2
Temperature Range Package Description Package Option
ADP5061ACBZ-2-R7 –40°C to +125°C 20-Ball WLCSP CB-20-9
ADP5061ACBZ-4-R7 –40°C to +125°C 20-Ball WLCSP CB-20-9
ADP5061ACBZ-5-R7 –40°C to +125°C 20-Ball WLCSP CB-20-9
ADP5061CB-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
2
For additional factory programmable options, contact a local Analog Devices, Inc., sales or distribution representative.
A
B
C
D
E
2.635
2.595
2.555
2.035
1.995
1.955
1
23
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.50
REF
0.660
0.600
0.540
SIDE VIEW
0.270
0.240
0.210
0.360
0.320
0.280
2.00 REF
1.50 REF
COPLANARITY
0.04
SEATING
PLANE
0.390
0.360
0.330
04-18-2012-A