Datasheet

Data Sheet ADP5050
Rev. 0 | Page 57 of 60
OUTLINE DIMENSIONS
1
0.50
BSC
BOTTOM VIEW
TOP VIEW
PIN 1
INDICATOR
48
13
24
36
37
EXPOSED
PAD
PIN 1
INDICATOR
*
5.65
5.60 SQ
5.55
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
0.30
0.25
0.20
04-26-2013-C
7.10
7.00 SQ
6.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 MIN
*
COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-2
WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION.
Figure 69. 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
7 mm × 7 mm Body, Very Very Thin Quad
(CP-48-13)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
2
ADP5050ACPZ-R7 −40°C to +125°C 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-48-13
ADP5050-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
2
Table 65 lists the factory default options for the device. For a list of factory programmable options, see the Factory Programmable Options section. To order a device
with options other than the default options, contact your local Analog Devices sales or distribution representative.