Datasheet

ADP5040 Data Sheet
Rev. 0 | Page 6 of 40
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
AVIN to AGND −0.3 V to +6 V
VIN1 to AVIN −0.3 V to +0.3 V
PGND to AGDN −0.3 V to +0.3 V
VIN2, VIN3, VOUTx, ENx, MODE, FBx, SW to
AGND
−0.3 V to (AVIN + 0.3 V)
SW to PGND −0.3 V to (VIN1 + 0.3 V)
Storage Temperature Range −65°C to +150°C
Operating Junction Temperature Range −40°C to +125°C
Soldering Conditions JEDEC J-STD-020
ESD Human Body Model 3000 V
ESD Charged Device Model 1500 V
ESD Machine Model 200 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
20-Lead, 0.5 mm pitch LFCSP 38 4.2 °C/W
ESD CAUTION