Datasheet

ADP5020
Rev. 0 | Page 25 of 28
OUTLINE DIMENSIONS
2.65
2.50 SQ
2.35
3.75
BSC SQ
4.00
BSC SQ
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
090408-B
1
0.50
BSC
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
20
6
16
10
11
15
5
EXPOSED
PAD
(BOTTOM VIEW)
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 30. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADP5020ACPZ-R7
1
−40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-4
ADP5020CP-EVALZ
1
Evaluation Board
1
Z = RoHS Compliant Part.