Datasheet

ADP322/ADP323 Data Sheet
Rev. A | Page 20 of 24
09288-051
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP322/ADP323. However, as can be seen from Table 7 , a
point of diminishing returns is eventually reached, beyond
which an increase in the copper size does not yield significant
heat dissipation benefits.
Place the input capacitor as close as possible to the VINx and
GND pins. Place the output capacitors as close as possible to
the VOUTx and GND pins. Use 0402 or 0603 size capacitors
and resistors to achieve the smallest possible footprint solution
on boards where area is limited.
Figure 55. Example of PCB Layout, Top Side
09288-052
Figure 56. Example of PCB Layout, Bottom Side