Datasheet

Data Sheet ADP322/ADP323
Rev. A | Page 19 of 24
0
20
40
60
80
100
120
140
0 0.2 0.4 0.6 0.8 1.0 1.2
TOTAL POWER DISSIPATION (W)
JUNCTION TEMPER
A
TURE, T
J
(°C)
1000mm
2
500mm
2
100mm
2
50mm
2
JEDEC
T
J
MAX
09288-047
Figure 51. Junction Temperature vs. Total Power Dissipation, T
A
= 25°C
0
20
40
60
80
100
120
140
00.20.40.6
0.8 1.0
1.2
TOTAL POWER DISSIPATION (W)
JUNCTION TEMPE
R
A
TURE, T
J
(°C)
1000mm
2
500mm
2
100mm
2
50mm
2
JEDEC
T
J
MAX
09288-048
Figure 52. Junction Temperature vs. Total Power Dissipation, T
A
= 50°C
0
20
40
60
80
100
120
140
0 0.2 0.4 0.6 0.8 1.0 1.2
TOTAL POWER DISSIPATION (W)
JUNCTION TEMPER
A
TURE, T
J
(°C)
1000mm
2
500mm
2
100mm
2
50mm
2
JEDEC
T
J
MAX
09288-049
Figure 53. Junction Temperature vs. Total Power Dissipation, T
A
= 85°C
0
20
40
60
80
100
120
140
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
TOTAL POWER DISSIPATION (W)
JUNCTION TEMPER
A
TURE, T
J
(°C)
T
B
= 25°C
T
B
= 50°C
T
B
= 85°C
T
J
MAX
09288-050
Figure 54. Junction Temperature vs. Total Power Dissipation and
Board Temperature