Datasheet
UG-186 Evaluation Board User Guide
Rev. 0 | Page 8 of 12
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of
the ADP322/ADP323.
Place the input capacitor as close as possible to the VIN (VIN1/
VIN2), VIN3, VBIAS, and GND pins. Place the output capaci-
tors as close as possible to the VOUT1, VOUT2, VOUT3, and
GND pins. Use 0402 or 0603 size capacitors and resistors to
achieve the smallest possible footprint solution on boards where
space is limited.
0
9299-010
Figure 10. Typical Board Layout, Top Side
09299-011
Figure 11. Typical Board Layout, Bottom Side